構裝能力

我們提供完整的資料收集、分析及嚴格的良率管控,以確保產品品質符合客戶的期望

Thermal Resister Analysis

在熱量的傳遞中,由於會透過固體或流體介質傳送,且傳送過程中將會遭受到介質之阻礙,此種阻礙即為熱阻對電子構裝元件而言,熱阻值是評估其散熱能力最常使用的指標。

Measure thermal Resistance

MCP Model

TSOP Model

WBGA Model

Input Information

  • BOM LIST
  • The drawings that it relates to the product
  • Analysis parameter

Using Software

  • Flotherm/Flotherm XT
  • Rhino
Measure Shadow Moiré for warpage

利用光柵即可達到干涉來量測面外位移的技術,陰影光柵和參考光柵本身干涉而產生條紋,分析這些條紋即可得出物體的變形量。

Shadow Moiré Temp-curve

Shadow Moiré Temp-curve

Warpage 3D profile

Warpage 3D profile

Warpage 2D profile

Warpage 2D profile

Input Information

  • Convection heating and cooling from 25℃ to 250℃
  • Follow JESD22-B112B

Using Software

  • Measurement by Akrometrix Shadow Moiré technique
Thermal stress and warpage analysis

當材料之熱膨脹係數不匹配,容易產生熱應力及熱應變,此時可由模擬來表示產品的翹曲程度。

Warpage (Z-axis Displacement)

Warpage Z-axis Displacement

Input Information

  • B.O.M List
  • The drawings that it relates to the product
  • Analysis parameter

Using Software

  • Ansys Mechanical
  • Rhino
Molding analysis

解決短射、流動不平衡、金線偏移、導線架偏移等製程問題,利用流動波前預測包封位置。

Filling process

Filling process

Wire sweep

Wire sweep

Input Information

  • B.O.M List
  • The drawings that it relates to the product
  • Analysis parameter

Using Software

  • Moldex 3D
  • Rhino
Electrical analysis

根據設計的結構建立3D模型,使用軟體進行電磁場計算、抽取寄生參數(電阻 R,電感 L,電容 C)與S參數(S parameter),並生成SPICE/IBIS等效電路模型。

3D模型建立

3d model setting
3d model setting

抽取寄生參數(RLC)

Wire sweep

S parameter

Wire sweep

Input Information

  • B.O.M List
  • The drawings that it relates to the product
  • Analysis parameter

Using Software

  • Ansys Q3D
  • Ansysy HFSS

BOC Design

BOC產品種類:Window BGA

BOC 2D model

BOC Design 2D Model

BOC 3D model

BOC Design 3D Model
COB Design

COB產品種類:TFBGA、eMMC、eMCP、POP、CARD type

COB 2D model

COB Design 2D Model

COB 3D model

COB Design 3D Model
Lead frame Design

Lead frame產品種類:TSOP1、TSOPII、QFN、SON

TSOP 2D model

COB Design 2D Model

TSOP 3D model

COB Design 3D Model

Necessary Information

  • Die information
  • Package outline
  • Ball assignment

Layout Software

  • Cadence
  • Altium
  • AutoCAD
  • CAM 350

測試與預燒能力

我們提供測試程式驗證、 Tester/Hi-Fix比對校驗、工程批及量產批驗證、並透過網路定時提供客戶即時的相關報表之服務。

Services
Burn-in
  • Monitor Burn-In
  • Test During Burn-In
  • Auto-Load/unload
  • Program Convert / Development
Final Test
  • DDRI ~V / LPDDRI~IV
  • SDRAM Final Test
  • FLASH Final Test
  • Logic Test
  • Mixed Signal Test
  • Program Convert / Development
Mark / Scan
  • Automatic Mark / Scan control
  • 3D Laser Scan
  • Laser / Ink Marking
T & R
  • Tray, T & R
  • Dry Baking
  • Packing
Engineering
  • Test Flow Control System
  • Powerful and Fully Automatic control system
  • Program Convert / Development

Sub-Outline
  • Service Introduction
  • Software & Hardware Development
  • Integrated Automation Introduction
TEST Work Item
Hardware Software Integrated Automation
BI Oven Design BI Program BI Barcode System
BI Oven Modify FT Program FT Barcode System
Burn-in Board Design Program Management System LMT Barcode System
Socket Design LS Barcode System
DR Barcode System
TP Barcode System
FT Barcode System

System Diagram
Net Work

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