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首頁 > 服務 > 測試服務 >
崩應
福懋科技提供專業的記憶體、邏輯IC
及混合訊號IC等產品之崩應和最終檢測之服務。
Burn-In Oven
SSE-B1120M
Burn-In Type
MBI
Slot Qty
60
Channel
48 / 96
Driver Voltage
VIH : 1.5V ~ +8.0V
VIL : < 0.4V
Driver Capacity
Sink Current : 200mA
Source Current : 200mA
Driver Skew
±5ns
Overshoot / Undershoot
Within 10%
Tr / Tf
Less 50ns(with load)
Address
X:16 Y:16
Burn-In Oven
SSE –B920
Burn-In Type
TDBI
Slot Qty
48
Channel
184
Driver Voltage
VIH : 2V~+8.0V
VIL : <0.4V
Resolution : 10mV
Driver Capacity
Sink Current : 120mA
Source Current : 120mA
Driver Skew
±5ns
Overshoot / Undershoot
Within 10%
Tr / Tf
Less 25ns(with load)
Address
X:16 Y:16
Burn-In Oven
Aehr MTX
Burn-In Type
TDBI
Slot Qty
30
Channel
256
Driver Voltage
VIH : 1V ~ +7.0V
VIL : <1V ~ -1.0V
Resolution : 50mV
Driver Capacity
Sink Current : 500mA
Source Current : 300mA
Driver Skew
±5ns
Overshoot / Undershoot
Within 10%
Tr / Tf
Less 10ns(with load)
Address
X:16 Y:16
Burn-In Oven
Ando AF8652
Burn-In Type
TDBI
Slot Qty
48
Channel
154
Driver Voltage
VIH : 1V ~ +7.0V
VIL : <50mv
Resolution : 10mV
Driver Capacity
Sink Current : 200mA
Source Current : 200mA
Driver Skew
±5ns
Overshoot / Undershoot
Within 10%
Tr / Tf
Less 30ns(with load)
Address
X:16 Y:16
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