Formosa Advanced Technologies Co., Ltd. is principally engaged in the provision of integrated circuit (IC) assembly and testing services, as well as module turn key services. Headquartered in Douliu, South Central Taiwan, the Company mainly offers services for small outline J-lead (SOJ) packages, thin small outline packages (TSOPs), small outline packages (SOPs), shrink small outline plastic packages (SSOPs), quad flat packages (QFPs), thin quad flat packages (TQFPs) and ball grid array (BGA) packages. During the year ended December 31, 2006, the Company obtained approximately 52%, 26% and 22% of its total revenue from its IC assembly, IC testing and Module and Flash card businesses, respectively.