Chip Array Package (COB) specification is as follows:
| Array (COB) |
Package Size
LxWxH (mm) |
Luminous Flux (Lm) |
CCT (K) |
CRI |
IF (mA) |
Vf (V) |
Power (W) |
Lm/W |
|
18x18x1.2 |
¡Ù500 |
3,000 |
¡Ù80 |
800 |
9.0~9.9 |
7.2~7.92 |
63.1~69.4 |
¡Ù560 |
3,000 |
¡Ù80 |
800 |
9.0~9.9 |
7.2~7.92 |
70.7~77.8 |
¡Ù650 |
5,000 |
¡Ù80 |
800 |
9.0~9.9 |
7.2~7.92 |
82.1~90.3 |
| Array (COB) |
Package Size
LxWxH (mm) |
Luminous Flux(Lm) |
CCT (K) |
CRI |
IF (mA) |
Vf (V) |
Power (W) |
Lm/W |
|
24x24x1.2 |
¡Ù1,000 |
3,000 |
¡Ù80 |
1,000 |
15.0~16.5 |
15.0~16.5 |
60.6~66.7 |
¡Ù1,200 |
3,000 |
¡Ù80 |
1,000 |
15.0~16.5 |
15.0~16.5 |
72.7~80.0 |
¡Ù1,290 |
5,000 |
¡Ù80 |
1,000 |
15.0~16.5 |
15.0~16.5 |
78.2~86 |
