FATC_LOGO FATC 中英文公司名稱
Home > Products > IC Packages > TSOP(I)/TSOP(II)
 

TSOP(I)/TSOP(II)
(Thin Small Outline Package Type I / II)

FATC offers only TSOP I 48L on Thin Small Outline Package type I and 50/54/66/86 leads on Thin Small Outline Package type II. TSOP(I) and TSOP(II) are defined according to thin profile small outline package with an overall thickness of as thin as 1.0mm.

APPLICATIONS

TSOP(I)/TSOP(II) are package solutions for portable electronic products, cell phones , memory modules, , PC cards, PDA, disc drives and telephone handsets.

FEATURES

  • Low profiles and lightweight
  • 8 inches and 12 inches
  • Existing BOM and process flow
  • Steady yield > 99.95%
  • Low cost
  • Pb free available
  • TSOP(I) body sizes from 11.8x8 up to 18.4x12 mm
  • TSOP(II) body sizes from 17.1x7.6 up to 22.2x10.2 mm
  • TSOP(I) 48 lead counts
  • TSOP(II) 50/54/66/86 lead counts
  • JEDEC standard outlines

RELIABILITY

• Moisture Sensitivity:JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Other Reliability Test:Follow Customer Request

 


  About FATC
 
Profile
Philosophy
History
Organization
Contact Us
  Services
 
Assembly Service
Testing Service
Module Service
LED
R & D
  Products
  IC Packages
DIMM
Flash Card
LED
 
 
  Quality system
  Quality Management
Quality Control
Quality Assurance
 
 
 
  Investor Relations
  Financials
Shareholder Service
Corporate Governance
 
 
 
  Careers
  Benefits
Training & Development
Recruitment
 
 
 
  CSR
  CSR
Corporate Governance
Stakeholder Engagement
Workplace Environment
RBA Commitment
Social Welfare