TSOP(I)/TSOP(II)
(Thin Small Outline Package Type I / II)
FATC offers only TSOP I 48L on Thin Small Outline Package type I and 50/54/66/86 leads on Thin Small Outline Package type II. TSOP(I) and TSOP(II) are defined according to thin profile small outline package with an overall thickness of as thin as 1.0mm.
APPLICATIONS
TSOP(I)/TSOP(II) are package solutions for portable electronic products, cell phones , memory modules, , PC cards, PDA, disc drives and telephone handsets.
FEATURES
- Low profiles and lightweight
- 8 inches and 12 inches
- Existing BOM and process flow
- Steady yield > 99.95%
- Low cost
- Pb free available
- TSOP(I) body sizes from 11.8x8 up to 18.4x12 mm
- TSOP(II) body sizes from 17.1x7.6 up to 22.2x10.2 mm
- TSOP(I) 48 lead counts
- TSOP(II) 50/54/66/86 lead counts
- JEDEC standard outlines
RELIABILITY
• Moisture Sensitivity：JEDEC Level 3 (30°C / 60% RH / 192 hours)
• Other Reliability Test：Follow Customer Request
