FBGA
(Fine Ball Grid Array)
FATC’s Fine Ball Grid Array offers 60/84/68/92/78/96 balls. FBGA is a die-up design, overmolded using 2, 4 layer BT substrate and 1.0 or 1.27mm ball pitch and above.
APPLICATIONS
FBGA makes an ideal solution for high-performance applications such as microprocessors / controllers, DSPs, memory andcelular and laptopl PC.
FEATURES
- Small, light, and Compacted
- Self-alignment during reflow
- Existing BOM and process flow
- Steady yield > 99.95%
- Low cost
- Pb free available
- FBGA body sizes from 8x8 up to 35x35 mm
- FBGA 54/60/84/68/92/78/96 ball counts
- All Pb-free solder
- BT substrates
RELIABILITY
• Moisture Sensitivity：JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 260 +0/-5 °C
• Other Reliability Test：Follow Customer Request
