BGA
Ball Grid Array
BGA is a die-up design, plastic overmolded BGA using 2, 4 layer BT substrate and 1.0 or 1.27mm ball pitch and above. It offers a high I/O replacement for the QFP package when the I/O exceeds QFP-256 limitations. FATC’s BGA offers improved electrical and thermal operation through multiple routing layers such as ground and power planes. Additionally, industry proven processes and materials provide assurance for reliable and long-term operation.
APPLICATIONS
FATC’s BGAs improved electrical and thermal performance make them an ideal solution for high-performance applications such as microprocessors / controllers, DSPs, high pin-count ASICs, gate arrays, memory and PC chipsets. The packages are also well suited to applications requiring improved portability such as cellular, wireless, laptop PCs and other similar products.
FEATURES
- 8x8 to 35x35 mm body sizes
- Perimeter and full ball arrays
- Ball counts available up to 456B
- Multiple routing layers for improved electrical performance
- BT substrates
- All Pb-free solder
- Passive component Optional.
- Multi-chip stacked
- Full in-house design ability
- JEDEC standard outlines
RELIABILITY
| Normal package : |
| • Moisture Sensitivity |
JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 260 +0/-5 °C |
| • Temp. Cycle Test |
-65/+150°C, 1000 cycles |
| • Pressure Cooker |
121°C, 100% RH, 2 atm, 168 hours |
| • High Temp. Storage Life test |
150°C, 1000 hours |
Lead Free / Green package :
| • Moisture Sensitivity |
JEDEC Level 3 (30°C / 60% RH / 192 hours), IR : 260 +0/-5 °C |
| • Temp. Cycle Test |
-65/+150°C, 1000 cycles |
| • Pressure Cooker |
121°C, 100% RH, 2 atm, 168 hours |
| • High Temp. Storage Life test |
150°C, 1000 hours |
Note: Sample preconditioning prior to environmental tests is as follows:
Baking 125°C, 24 hours ◊ Pre-con IR Reflow 3 times
